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Transcend Recommends Corner Bond and Underfill to Increase Reliability for its Embedded Products

Embedded systems are marked by a need for small components, unmatched reliability, and the ability to withstand harsh conditions. Transcend Information, Inc., a leading manufacturer of industrial-grade products, offers corner bond and underfill as customization options for its embedded products to increase reliability under high thermal or vibratory stress, high gravitational acceleration, and high fatigue cycle applications. Transcend continues to invest in developing cutting-edge technologies and expanding its embedded-use flash and DRAM products, offering a track record of excellence in the demanding embedded application market.

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Armaggeddon Cosmic III Lite Review – One Budget Gaming Headset to...

Introduction One gaming headset to rule them all! Yet a budget one too. Hey guys, meet Armaggeddon Cosmic III Lite. It is a versatile gaming...

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Kingston Technology Joins Forces with the Upcoming Film Ghostbusters: Frozen Empire

Continuing its legacy of connecting people to fun, adventure and memories, Kingston Technology, a world leader in memory products and technology solutions, has teamed...