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Transcend Recommends Corner Bond and Underfill to Increase Reliability for its Embedded Products

Embedded systems are marked by a need for small components, unmatched reliability, and the ability to withstand harsh conditions. Transcend Information, Inc., a leading manufacturer of industrial-grade products, offers corner bond and underfill as customization options for its embedded products to increase reliability under high thermal or vibratory stress, high gravitational acceleration, and high fatigue cycle applications. Transcend continues to invest in developing cutting-edge technologies and expanding its embedded-use flash and DRAM products, offering a track record of excellence in the demanding embedded application market.

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Magcubic HY310X In-Depth Review – Everything You Need To Know Here!

Meet Magcubic HY310X Mini Android Projector with 420 ANSI Lumens. Enjoy large screen in small room with 0.8 throw ratio. Useful auto focus, vertical...

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Kingston FURY Releases High Performance PCIe 5.0 NVMe SSD

Kingston FURY, the high-performance division of Kingston Technology, a world leader in memory products and technology solutions, announces its PCIe 5.0 NVMe M.2 SSD,...